Product Overview
The JetStep W2300 System has been specifically designed to meet advanced packaging challenges head on. As resolution, overlay and many more technical specifications become tighter and more sophisticated for semiconductor advanced packaging processes, fulfilling lithography requirements becomes a challenge. With specialized large field optics and key system advantages, the system delivers maximum throughput without limiting resolution and overlay.
Applications
- Fan-out wafer level packaging (FOWLP)
- Wafer-level chip scale packaging (WLCSP)
- Through silicon via (TSV)
- Interposers
- MEMS
- LED
- Non-standard substrates
Specifications
- High-fidelity projection lens and illumination system delivers the largest process window for 2/2
- User-selectable wavelength settings
- Automatic compensation of die shift for superior registration to zero layer
- Backside alignment
- 6-inch square reticle format enables cost efficient reticle and lower COO
- 6 degrees of freedom reticle chuck with automated magnification adjustment for precise layer to layer registration
- Automated reticle handling and storage system with fast reticle exchange to maximize throughput
- Fully programmable and flexible pattern recognition alignment system
- Real time “on the fly” autofocus at every exposure site to automatically adjust focus over topology
- Environmental management system to mitigate fab contamination