NSX 320

Request Info
NSX 320

Designed specifically for advanced packaging processes

The NSX® family is the market leader for automated macro defect inspection for advanced packaging. The NSX 320 system serves critical inspection needs for 2D automated inspection, edge trimming metrology, wafer alignment during bonding processes and sawn wafers on film frames. With high acceleration staging, high-speed multi-processor computing and highly flexible software capabilities, the NSX 320 delivers industry-leading speed and sensitivity.

  • Choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 300mm whole wafers
  • The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution. The turret assembly has five (5) available slots and includes any three (3) of 1X, 2X, 3X, 5X, 10X and 20X objectives. Other slots may be populated with purchasable additional objectives.
  • The 2D defect and metrology verification standard is designed to verify system functionality and repeatability
  • Programmable light tower
  • Standard docking module
  • Throughput up to 120 wph (10µm)
  • Five minute recipe creation
  • Resolution flexibility (10µm to 0.5µm)
  • Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer
  • Teams with edge and backside modules for all-surface solution

The Rudolph Yield Forum™ is a technology and applications seminar for semiconductor manufacturing professionals. Rudolph applications experts discuss industry trends and share current applications data and results from ongoing tool evaluations and production processes at various fabs. Below is a list of recently presented subjects—please fill in the form and check the presentations you would like sent to you.

July 14, 2015

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

April 27, 2015

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

April 1, 2015

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

February 9, 2015

Ruling Issued in Rudolph’s Patent Infringement Case Against Camtek

August 11, 2014

Rudolph Receives Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems

February 10, 2014

Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for Through Silicon Via Process Development

July 24, 2013

Rudolph Announces New Metrology Suite for Advanced Packaging

April 29, 2013

Rudolph Purchases Selected Assets from Tamar Technology; Adds 3D Measurement Capability for Advanced Packaging Applications

February 11, 2013

Rudolph’s Discover Yield Management Software Gains Traction in Advanced Packaging Applications

December 12, 2012

Rudolph Enters Back-end Lithography Market with Breakthrough Total Solution for Advanced Packaging

May 29, 2012

Large Assembly and Test Facility Selects Rudolph NSX Series to Meet Advanced Packaging Demand

October 3, 2011

Rudolph Fulfills Multiple System Orders for TSV Inspection and Metrology

June 7, 2011

Rudolph Receives First Order for NSX 320 Automated Macro Defect Inspection System for TSV Processes

November 30, 2010

Rudolph Technologies Collaborates with Asia OSAT on Development and Characterization of Stacked Packaging Process

February 9, 2009

Rudolph Announces Probing Process Analysis Capability for NSX Wafer Inspection System