Oct 22 — Oct 23, 2019 San Jose, California

International Wafer Level Packaging Conference

Exhibit - Booth 30
10:00am — 4:30pm

Rudolph is pleased to join the exhibition at IWLPC in 2019! IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

Please visit us at our booth to discuss your specific application challenges or catch one of our experts during the conference:

Conference speeches

Tuesday, October 22

2:00pm: Fan Out Panel Lithography Solutions to Overcome Die Placement Error, Predict Yield, Increase Throughput and Reduce Cost, Keith Best

4:00pm: Application of Acoustic Metrology for In-line Microbump Process Monitoring in Advanced Packaging, Robin Mair

4:00pm: PANEL DISCUSSION: Large Organic Panels: How Can We Achieve 2µm L/S? Keith Best

Wednesday, October 23

12:00pm: Validating Die Crack Inspection with Topography Based Image Sensor, Woo Young Han