Meeting the Metrology and Inspection Needs of Next-generation Advanced Packaging Processes
Advanced packaging processes are becoming more complex and package feature sizes are shrinking, leading to process control requirements similar to the front-end applications where many AP processes or iginated. As feature sizes continue to decrease, performance requirements for inspection and measurement tools are becoming more difficult to meet. In addition to improvements in basic performance characteristics, like speed and sensitivity, these tools must also incorporate innovative solutions to problems that are specific to AP applications, including accurate bump height measurements and sensitivity to nonvisual defects. Ultimately, the process control needs of AP processes are best met by a flexible system that can deliver the full range of required capabilities in a single, high-throughput, capital-efficient platform.