Fan-out Packaging 

Whether on wafer or panel, fan-out packaging offers reduced package cost and/or form factor. See how Rudolph can solve the most pressing challenges.

Die Shift

Real-time die shift correction

The elimination of the substrate in fan-out packaging is key to cost reduction and slim form factor. To facilitate the removal of the substrate, epoxy mold compound is used to reconstitute known good die. Both pressure and heat are used in the molding process after pick and place. In all cases, this process causes the placed die to shift and the reconstituted substrate to warp.

Rudolph's inspection, metrology, lithography, and advanced software are combined to dynamically measure and adjust for this shift, whether working on wafers or panels, to help ensure overlay specifications are met and subsequent RDL layers are imaged correctly.

Warped Substrates

Handling adverse effects of the reconstitution process

Along with die shift issues, when pressure and heat are applied during the molding process after pick and place, a reconstituted substrate will warp. Warped substrates are uniquely challenging to handle and require specialized equipment designed to eliminate warp while being non-destructive.

Whether the process is wafer or panel based, Rudolph has developed handling solutions for the most warped substrates, to help ensure successful processing of the reconstituted substrate and achievement of high yields.

Fine Pitch RDL

Enabling heterogeneous die integration

The need for more functionality in FOWLP and heterogeneous SiPs is driving a rapid increase in the density of redistribution layers. Line and space (L/S) widths are projected to move from the most advanced 5/5 microns to 1/1 microns and below.

With this scaling comes the need for advanced lithography and inspection to address process complexity and associated defectivity. Rudolph's Jetstep system offers variable NA technology and large-field imaging to allow for 1 micron L/S lithography for large form factor packages. Additionally, inspection requirements are typically 50% of the L/S specification. Rudolph's latest inspection systems reach below 1 micron and enable large die and package inspection to meet the challenges on current and future defect inspection requirements.

Reduced Review

Reduce manual review by up to 70%

Advanced packaging processes are becoming more and more like processes from the front-end of the fab. With complexity comes the need for process control and defect inspection to ensure known good die leave the fab. Defect review is time consuming and prone to human error. Rudolph's ADC software automatically analyzes defect images and classifies the defects to reduce manual review by up to 70% saving time, money, and ensuring consistent yield.

Non-Visual Defects

See previously undetected defects

Non-visual defects are a common type of process related defects in advanced packaging that stem from the lithography process which can cause degraded device performance or electrical failures. Traditional bright field and dark field inspection modes have struggled to detect these defects or provide a method to quantify their existence which has led to accepting defective devices into the downstream process.

Rudolph's novel approach to solve this problem provides customers a solution to detecting, controlling and fine tuning the litho process as well as helping to ensure the detection of yield-limiting defects that were previously undetectable.

Consulting and Applications Services

Rudolph's process control consulting services allow busy manufacturers to focus on production while we examine how to improve the process.

The Rudolph applications teams have over twenty years of experience with hundreds of successful projects worldwide across multiple industries. Contact us today to discuss your application study needs.

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