Post Saw 

The evolution of semiconductor device materials for advanced packaging has resulted in more stringent dicing process requirements. Issues during die singulation can result in chips and cracks that impact the long-term reliability of devices.

Side Wall Cracks

The presence of side wall cracks are unavoidable so it is important to detect and feedback the failure as early as possible to improve cost and deliver a known good package that will not have degraded performance or fail once it reaches the end user.

Patterned inspection systems can detect the defect of interest but fail to differentiate between a killer defect and an acceptable defect which leads to a loss in yield that cannot be recovered without costly operator review.

By combining our unique die seal ring inspection capability with IR imaging and ADC we are able to provide a complete solution for differentiating between killer side wall cracks induced by the dicing process that could lead to downstream failure or reliability issues and cracks that simply appear to approach the seal ring boundary.

Die Seal Ring

Die Seal Ring

Process control monitor (PCM) and test element group (TEG) structures can cause delamination (tear-out), chips and cracks during the dicing process. Furthermore, these are reticle-based features that repeat at periodic intervals that challenges traditional automated optical inspection techniques.

Rudolph's unique die seal ring inspection solution provides modeling to account for all areas of the scribe line including the PCM/TEG structures to allow detection and classification of detection without the loss of sensitivity or throughput.

Kerf Metrology

As scribe lines shrink, dicing process control is more critical to die yield.

SAW cut position, width, and depth are key contributors that all impact the final yield. Process development is traditionally conducted on a manual or semi-automated sampling basis which leads to incomplete failure analysis and process develop.

Kerf metrology provides 100% inspection and metrology of all saw cuts on a wafer with real-time feedback. When combined with Discover software, process development can be tracked and quanitifed to improve best known method development.

Process Optimization

A single failure is not acceptable

Sampling-based measurement and analysis is insufficient to deploy a first time right solution for the different process technologies used in many saw departments. This can lead to frequent process excursions until all of the variations are learned and addressed.

Rudolph provides bi-directional correlation of equipment sensor data with diced product data to give users a comprehensive, easy-to-understand view of their process, allowing them to use predictive analytics to take immediate action, thus reducing product jeopardy and improving the overall effectiveness of their manufacturing operations. The savings that result from avoiding a single failure at a critical process step can easily justify the return on investment for this type of process control solution.

Consulting and Applications Services

Rudolph's process control consulting services allow busy manufacturers to focus on production while we examine how to improve the process.

The Rudolph applications teams have over twenty years of experience with hundreds of successful projects worldwide across multiple industries. Contact us today to discuss your application study needs.

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