Detect process-related defects at full speed
The AWX utilizes background scattering (haze) data to monitor process signatures and low contrast haze defects. Haze defects can be correlated to process parameters such as surface roughness and grain size. This delivers high speed, full-wafer metrology for bare wafers and blanket films.
The capability is used for qualification and monitoring of process tools to capture blanket film defects, enabling the monitoring of defects that may be introduced during semiconductor processing steps. It is also used by IC manufacturers to ensure that incoming wafer supply meets strict quality specifications.