A-Z Product Index

Know what you are looking for? Here's a list of all Rudolph products.

Discover® Defect Software

Inline yield and defect management

Discover® FDC Software

Integrated, intelligent fault detection and classification software

Discover® Patterns Software

Spatial pattern recognition software

Discover® Review Software

Offline defect review and manual classification software

Discover® Run-to-Run Software

Drive processes to target with intelligent run-to-run control

Discover® Yield Software

Offline yield analysis and data mining software

Dragonfly® G2 System

High speed 2D/3D automated inspection and metrology for defects and bumps

EB30 Module

Edge and backside inspection

F30™ System

Advanced macro inspection for front-end manufacturers

Firefly® Series

Sub-micron automatic defect inspection for wafers and panels

JetStep® G35 System

High-resolution imaging for flat panel display applications up to Gen 3.5 size

JetStep® G45 System

High-resolution imaging for flat panel display applications up to Gen 4.5 size

JetStep® X300

Advanced packaging lithography system for 200mm, 300mm and 330mm wafer sizes

JetStep® X500 System

Designed for PCB or Advanced Packaging manufacturing applications, incorporating a 250mm x 250mm large field exposure area achieving 3μm resolution over a broad DOF with throughput of >110pph

JetStep® X700 System

Advanced packaging lithography system for rectangular or square panel substrates up to 720mm x 600mm substrate size

MetaPULSE® G System

Acoustic film metrology system that provides accurate, in-line thickness measurements of semi-transparent and metal films on product wafers

NovusEdge™ System

All-surface, automated, unpatterned wafer inspection

NSX® 220 System

Low-cost macro defect inspection for traditional back-end semiconductor manufacturing

NSX® 330 System

2D automated defect inspection and sample 3D inspection for advanced packaging

PrecisionWoRx® VX4 System

Wafer probe card test and analysis system

Probe Card Interface

Simulating the tester interface on the test floor

S2000™ System

Transparent film metrology for specialty foundry, RF, MEMS market requiring small wafer handling from 100 to 200mm

S3000™ Series

Transparent film metrology for front-end semiconductor manufacturing

TrueADC® Software

Automated defect classification software

Voyager™ System

Wafer probe card test and analysis system