Discover® Review Software is an intuitive classification solution that rapidly guides users through the sequences of defect classification and correlation.
Discover® Review Software improves system productivity by enabling its users to review results offline. Examine defect results from any inspection tool connected to the Discover server. Multiple client usage enhances productivity by supporting concurrent review with overwrite protection while partial review status enables operator shift changes. Visualize defects individually or collectively using an interactive, all-surface (front, edge, back) wafer map viewer. Its gallery review mode allows users to select individual or multiple images by wafer or die for fast classification and defect comparison. Discover Review Software also includes a large number of wafer map exports and customizable reports.
Inline yield and defect management
Automated defect classification software with a dynamic defect library
Automated 2D/3D inspection and metrology for defects and bumps
Sub-micron automatic defect inspection for wafers and panels