Combining 2D and 3D technologies to detect yield-robbing defects and measure features critical for today's packaging technology, the Dragonfly system will reset the industry's expectations for throughput, accuracy and reliability.
2D imaging technology provides fast, reliable inspection for defects down to one micron. Rudolph’s patented Truebump™ Technology combines multiple 3D metrology techniques to deliver 100% bump height. This new technology is the foundation of Rudolph’s products designed to offer fast throughput, increased brightfield and darkfield sensitivity and solves site alignment challenges for large die.
The Dragonfly system is tightly integrated with control and analytical software for real-time analysis and review, IR defect review, while also providing offline review options. When massive amounts of bump data are generated during inspection, users now have the analytical tools to visualize data, correct process variations and improve yields.
Inline yield and defect management
Offline defect review and manual classification software
Today's bumping processes create features in a wide variety of shapes, densities, quantities and materials.
MEMS devices require complex and unique manufacturing processes and require a unique approach to process control.