Product Overview
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
Applications
- After develop inspection (ADI)
- Fab Outgoing QA
- Post CMP inspection
- After etch inspection
Specifications
- Throughput up to 120 wph (10µm)
- Resolution flexibility (10µm to 0.5µm)
- Three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer
- Teams with edge and backside modules for all-surface solution