Product Overview
The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling. It incorporates the largest available exposure field with resolution capability to 2/2 and options for increased resolution to 1/1.
Applications
- Fan-out panel level packaging (FOPLP)
- Through silicon via (TSV)
- Interposers
- Redistribution lines (RDL) / Underbump metallization (UBM)
- Non-standard substrates
Specifications
- High-fidelity projection lens and illumination system delivers the largest process window for 2/2
- User-selectable wavelength settings
- Automatic compensation of die shift for superior registration to zero layer
- Backside alignment
- 6-inch square reticle format enables cost efficient reticle and lower COO
- 6 degrees of freedom reticle chuck with automated magnification adjustment for precise layer to layer registration
- Automated reticle handling and storage system with fast reticle exchange to maximize throughput
- Fully programmable and flexible pattern recognition alignment system
- Real time “on the fly” autofocus at every exposure site to automatically adjust focus over topology
- Environmental management system to mitigate fab contamination