JetStep® X500 System

The Rudolph JetStep X500 system is designed to provide PCB and OSAT manufacturers with a lithography solution capable of high volume manufacturing for applications in the mobile devices, automotive, advanced packaging, medical or other industrial areas. The Rudolph Jetstep X500 exposes panel-type substrates made of CCL, FR4, composite, glass or other materials.  

Product Overview

The Rudolph JetStep X500 panel lithography system is optimized for volume manufacturing of high-end PCB and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of PCB or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp. The JetStep X500 system incorporates the largest available exposure field with resolution capability to 3/3 and options for increased resolution to 1/1 at smaller field sizes.  


JetStep X500
JetStep X500

Applications

Specifications

  • 3/3µm resolution with a high-fidelity projection lens and illumination system that delivers a large process window
  • 250mm x 250mm square exposure field
  • ±1 µm overlay capability
  • ±100 ppm magnification compensation (automatic) with independent x, y magnification adjustment (Anamorphic Magnification Adjustment)
  • ±400 ppm radial magnification compensation (automatic)
  • Automatic compensation of die shift for superior registration to zero layer
  • 6 inch square reticle format enables cost efficient reticle and lower COO

  • 6 degrees of freedom reticle chuck with automated magnification adjustment for precise layer to layer registration
  • Automated reticle handling and storage system with fast reticle exchange to maximize throughput
  • Fully programmable and flexible pattern recognition alignment system
  • Real time “on the fly” autofocus at every exposure site to automatically adjust focus over panel topology
  • Environmental management system to mitigate fab contamination
  • Handling: expose all substrate types up to Gen 3.5 (600mm x 720mm) – square and rectangle silicon, glass, composite material

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