JetStep® X700 System

The Rudolph JetStep X700 system is designed for processing panels to meet critical industry fan-out panel-level packaging requirements and extendible to sub-micron imaging processes. 

Product Overview

The JetStep X700 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel level packaging, such as; die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling. It incorporates the largest available exposure field with resolution capability to 2µm and options for increased resolution to 1µm.  


JetStep X700
JetStep X700

Applications

Specifications

  • High-fidelity projection lens and illumination system delivers the largest process window for 2µm and 1µm resolutions
  • User-selectable wavelength settings
  • Automatic compensation of die shift for superior registration to zero layer
  • Backside alignment
  • 6 inch square reticle format enables cost efficient reticle and lower COO
  • 6 degrees of freedom reticle chuck with automated magnification adjustment for precise layer to layer registration

  • Automated reticle handling and storage system with fast reticle exchange to maximize throughput
  • Fully programmable and flexible pattern recognition alignment system
  • Real time “on the fly” autofocus at every exposure site to automatically adjust focus over panel topology
  • Environmental management system to mitigate fab contamination
  • Handling: expose all substrate types up to Gen 3.5 – square and rectangle silicon, glass, composite material

You Have
a Challenge? We Love
a Challenge.

Let's Talk