Designed specifically for back-end manufacturers looking for exceptional cost of ownership, the NSX 220 system provides macro defect inspection for wafers up to 300mm in size.
The NSX 220 System is a streamlined version of the NSX 330 System, designed to provide automatic defect inspection at a low price point for traditional back-end manufacturing who do not need the added capabilities of the NSX 330 System for advanced packaging. Completely revolutionized from the previous generation of NSX equipment, the NSX 220 System leverages Rudolph innovations including its state-of-the-art hardware and software platform to optimize productivity and minimize the need for operator assistance.
The automated macro defect inspection system uses gray-scale image analysis (with color image capture) to provide fast, accurate inspection and metrology in final manufacturing applications for wafers up to 300mm in size. It can detect traditional advanced macro defects such as scratches, mechanical damage, foreign materials, voids and probe damage, while also performing two-dimensional measurements on bumps, probe marks and edge trim processes. All defect and metrology data generated during inspection can be seamlessly transferred into the Discover software database for comprehensive yield analysis and process optimization.