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MetaPULSE-G System

Delivers superior performance on Cu films that are critical in advanced device technologies and new TSV processes
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Probe Card Interface

Customer and application-specific mechanical and electrical interfaces that are critical for the probe card test and analysis process
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Process Sentinel Software

Monitor your process 24/7, and trace surface patterns to inline process issues
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09/30/2009

SEMICON Taiwan

Visit Rudolph at booth 362 in Hall 3
06/15/2009

Rudolph Announces All Surface Front-end Inspection Sale to Memory Manufacturer

Taiwan DRAM manufacturer orders all-surface inspection system for front-end manufacturing process control
06/04/2009

Spire to Use Rudolph’s Process Control Software in its Turnkey Solar Cell Lines

05/11/2009

Rudolph Announces New MetaPULSE-G Copper Film Metrology System

Latest PULSE™ Technology offers complete copper process control solution for advanced technology nodes and emerging TSV applications