Yield Forum Series
The Rudolph Yield Forum™ is a technology and applications seminar for semiconductor manufacturing professionals—fab managers, tool owners and process engineers. Launched in 2006, Yield Forums have been held in all major semiconductor manufacturing regions around the world. A typical agenda might include sessions for front-end wafer processing, back-end final manufacturing, probe card test and analysis and LED manufacturing. Speakers from top fabs join Rudolph applications experts to discuss industry trends and share current application data and results from ongoing tool evaluations and production processes at various fabs.
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2014 Yield Forum Schedule
15 April - Shanghai, China
31 July - Singapore
17 September - Regensburg, Germany
2013 Yield Forums
7 May - Hsinchu, Taiwan
6 December - Tokyo, Japan
10 December - Seoul, Korea
October 13 - 16, 2014
Town and Country Conference Center
San Diego, California, USA
Join Rudolph at IMAPS 47th International Symposium on Microelectronics this fall to learn more about Rudolph’s product suite for the demanding requirements of the advanced packaging market, including 2D/3D bump inspection, RDL and overlay metrology, and a lithography stepper specifically designed for the back-end. Turn data into useful information with Rudolph’s proprietary software solutions including run-to-run control, fault detection and classification and yield management systems.
October 7-9, 2014
Rudolph looks forward to co-exhibiting with Silicon-Saxony in Grenoble, France at Semicon Europa 2014. Plan to stop by and talk to one of our experts regarding your application needs. We look forward to meeting you.
September 3 - 5, 2014
TWTC Nangang Exhibition Hall
Rudolph looks forward to continuing to exhibit in the TWTC Nangang Exhibition Hall at Semicon Taiwan. Plan to stop by the booth and talk to one of our experts regarding your application needs. We look forward to meeting you.
Semiconductor Wafer Test Workshop
June 6-11, 2014
Rancho Bernardo Inn
San Diego, CA, USA
The IEEE SW Test Workshop is the only workshop specializing in semiconductor wafer level testing. It has a comprehensive technical program that is comnplemented by social activities which promote networking and sharing among the attendees. Stop by Rudolph's booth for an opportunity to meet in person and learn about our probe card test and analysis products.
IEEE Electronic Components and Technology Conference
May 27 - 30, 2014
Walt Disney World Swan & Dolphin Resort
Lake Buena Vista, FL USA
Heading to ECTC this spring? Stop by the Rudolph exhibit to speak with our experts about new advanced packaging inspection. lithography, metrology and software solutions. Learn more about Rudolph’s product suite for the demanding requirements of the advanced packaging market, including 2D/3D bump inspection, RDL and overlay metrology, and a lithography stepper specifically designed for the back-end. Turn data into useful information with Rudolph’s proprietary software solutions including run-to-run control, fault detection and classification and yield management systems.
Yield Forum China
A Technology and Applications Forum presented by Rudolph Technologies
15 April 2014 | 2014年4月15日
Shanghai, China | 上海瑞吉红塔大酒店
The Hongta Hotel, 889 Dongfang Rd, Pudong, Shanghai
Featuring guest speakers from local fabs, the Rudolph Yield Forum provides process engineers, fab managers and tool owners with new application data and process control techniques that address current process challenges.
Agenda Highlights | 研讨会日程介绍
Wafer Processing (Front-end) Session | 前段芯片制造
450mm Inspection and Metrology Update
TSV Middle Inspection and Metrology
Advanced Node Transparent Film Metrology
Server-centric Productivity Solutions for Metrology
Bare Wafer Inspection
Fleet Management: Optimizing your Inspection Systems
Factory-wide Data Mining Techniques
Effects of Acoustic Reflectance at Different Wavelengths on PULSE Performance
Final Manufacturing (Back-end) Session | 后段封装和测试
Bringing Front-end Process Requirement into the Back-end
High Speed Inspection and Metrology for Advanced Packaging Processes
Lithography Solutions for panel Fan-out Packaging & High Density Interposers
Etch Chamber Clean and Blank Carrier Wafer Inspection
Metrology Techniques for Advanced Packaging Processes
Thin/Warped Wafer Lithography Solutions
Improving Wafer Saw Stability
A Comprehensive Solution for Post-saw Delamination
Closed Loop Total Solution for Advanced Packaging Lithography
Trends in Cu Pillar Bump Metrology and Yield Improvement Strategies
**Topics subject to change
For More Information: 更多信息请联系:
Contact: 联系人:Wendy Wang, Rudolph China
IMAPS Device Packaging
March 11 - 13, 2014
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
Visit the Rudolph booth at IMAPS Device Packaging exhibition to learn about the unique solutions Rudolph can offer for advanced packaging, including inspection, metrology, lithography, process control and data management software.
Stop by the following Technical Sessions on Wednesday, March 12:
Elvino DaSilveira will present at the morning technical session at 11:30am on the topic of New Lithography Requirements driven by 2.5D Interposer Manufacturing.
Richard Beaver will present at the afternoon technical session at 11:30am on the topic of Fault Detection and Classification in Advanced Packaging.
Russ Dudley will present at the afternoon technical session at 5:00pm on the topic of Metrology and Inspection for New Interconnects in Advanced Packaging.
Reza Asgari will present at the afternoon technical session at 5:00pm on the topic of Use of Darkfield Laser Technology in Monitoring Particles Generated by Process Tools in Cu Pillar Bumping.
Rudolph will present two posters during the Interactive Poster Session from 5:30-6:30pm. Topics will include, Optical and Acoustic Metrology Techniques for 2.5 And 3D Advanced Packaging and Flip Chip/WLP: Fault Detection and Classification in Advanced Packaging.
Full conference program is available on the IMAPS website.
Strategies in Light
February 12-14, 2013
Santa Clara Convention Center
Visit the Rudolph exhibit at SIL 2013 to learn about the manufacturing software making a difference to LED manufacturers—a suite of advanced analysis and control software systems that are designed to maximize ROI, allowing LED manufacturers to gain market share through lower ASP, increase profits through R&D investments, and enable new markets.
Matthew Chriss will present during the Manufacturing Track on Thursday, February 14 at 9:00am on the topic of Fleet Management via Process Control Software. Review the rest of the conference program on the SIL website.
November 7-8 2012
Double Tree Hotel, San Jose, CA
Rudolph will exhibit at the International Wafer-Level Packaging Conference this fall.