2x reduction stepper for advanced packaging applications
Designed and Engineered for Advanced Packaging
In order to deal with increased I/O, enhanced functionality, power efficiency and higher frequency, IDMs and OSATS are moving to advanced packaging technologies such as TSV and 3D. However, the associated substrates and processes can be a challenge--the added performance requires finer features, but the stressful processes required can result in warped substrates. Since most packaging is an additive process, thick films are used to enable the creation of features. In order for equipment to effectively function in this environment, it must overcome these challenges.
The Rudolph JetStep™ System has been specifically designed to meet these challenges head on. A large printable field combined with user-selectable wavelength options maximizes throughput while not limiting resolution when needed. High-fidelity optics image the fine features required while at the same time achieving superior depth of field to minimize non-flatness effects. On-the-fly auto focus and an innovative reticle management system improve yield and utilization. These unique features—and more—are available today in a revolutionary lithography system specifically designed to meet advanced packaging challenges.