2x reduction stepper for advanced packaging applications
Designed and Engineered for Advanced Packaging
In order to deal with increased I/O, enhanced functionality, power efficiency and higher frequency, semiconductor manufacturers are moving to advanced packaging technologies such as fan-out wafer level chip scale packaging (WLCSP) and 3D packaging. While front-end manufacturers have moved wafer sizes in well-defined fashion, the packaging world is not constrained to such specific sizes. Fan-out WLCSP is manufactured both as round wafers that are non-standard and sizes in between 300mm and 450mm, but also can be fabricated on rectangular glass panels and rectangular organic laminates. However, the associated substrates and processes can be a challenge--the added performance requires finer features, but the stressful processes required can result in warped substrates. Since most packaging is an additive process, thick films are used to enable the creation of features. In order for equipment to effectively function in this environment, it must overcome these challenges.
The Rudolph JetStep™ Lithography System has been specifically designed to meet these challenges head on. A large printable field combined with user-selectable wavelength options maximizes throughput while not limiting resolution when needed. High-fidelity optics image the fine features required while at the same time achieving superior depth of field to minimize non-flatness effects. On-the-fly auto focus and an innovative reticle management system improve yield and utilization. These unique features—and more—are available today in a revolutionary lithography system specifically designed to meet advanced packaging challenges.
Seeking to improve cost of ownership, advanced packaging facilities considering the transition from wafer to panel manufacturing can rely on the JetStep™ Panel Lithography System. This new platform evolution is perfectly suited to Rudolph's advanced packaging expertise and the JetStep System's flat panel display origins.
Stepper designed for up to Gen 3.5 advanced packaging panel lithography