Your partner for innovative solutions that improve time to market, yield, and product reliability.

Defect inspection, metrology, lithography, and smart manufacturing software solutions for semiconductor manufacturers to accelerate product and process development, increase yields and reduce costs to enable customers to be first-to-market with premium products at premium prices.

Technology and solutions spanning incoming bare wafer inspection to final package. Focused on the most complex process challenges.

Explore how your process could improve:

Bare Wafer

Bare Wafer

Bare wafer manufacturers provide the quality silicon wafers needed for today's semiconductor manufacturing.

Logic

Logic

Moore's Law continues to drive the scaling of logic devices and, likewise, the challenges to process and process control.

Memory

Memory

Memory has become the cornerstone of the mobile world and one of the most critical semiconductor devices manufactured today.

RF

RF

Mobile communications and miniaturization has led to an explosion in the quantity and complexity of the RF devices needed in this connected world.

MEMS

MEMS

MEMS devices fuel innovation for IoT in industrial and consumer electronics, and the complex and unique manufacturing processes require a unique approach to process control.

Image Sensors

Image Sensors

Cameras have revolutionized the way we see the world through our mobile devices. Pixel size has decreased and the array density increased to improve camera resolution.

Fan Out

Fan Out

Whether on wafer or panel, fan-out packaging offers reduced package cost and/or form factor. See how Rudolph can solve the most pressing challenges.

Bumping

Bumping

Today's bumping processes create features in a wide variety of shapes, densities, quantities and materials. Collectively, they create the connections that drive device functionality, quality and yield.

Flat Panel Display

Flat Panel Display

Today’s mobile displays are becoming more sophisticated and new technologies are needed to advance the industry to next-generation technologies such as foldable and rollable displays.

Probe Test

Probe Test

Probe (or "wafer" or "sort") test is increasingly more important as hybrid and 2.5/3D devices become prevalent.

Post Saw

Post Saw

Today's more stringent dicing process requirements bring light to issues that may occur during die singulation that impact the long-term reliability of devices.

View All Markets

What's New

Great Careers: Apply Within

Positively affecting lives by enabling a smarter, more connected and energy efficient world.

Do you have passion, urgency, and integrity? Do you have a desire to use innovation and quality to drive results? Do you believe in putting customers first to become successful? If so, we want to talk with you.

Are you ready to improve the world with us?

Explore Careers at Rudolph Tech