Flanders, New Jersey (May 2, 2013)—Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, announced today that the first of its new JetStep™ Photolithographic Systems has been accepted and sold to a leading provider of advanced semiconductor packaging and test services. The system is being used for wafer level packaging processes where its flexible substrate handling and unique optical capabilities deliver valuable benefits. As noted in Rudolph’s release announcing its entrance into the back-end lithography market, the Company’s inaugural JetStep System was shipped and installed in the 2012 fourth quarter in Asia. The system has received acceptance and was put in production during the 2013 first quarter.
Mayson Brooks, senior vice president and general manager of Rudolph’s Advanced Packaging Lithography Business Unit, noted, “Adoption of Rudolph’s revolutionary 2X reduction system confirms our belief that the unique capabilities of the JetStep System are the best available solution for the highly demanding lithography needs specific to advanced packaging processes. These needs, such as the ability to accommodate warped-wafer substrates, are markedly different from front-end lithography. In addition, the JetStep System’s optical configuration—with its large field of view, long working distance, on-the-fly autofocus, programmable field apertures and automatic magnification correction—delivers unique performance and throughput advantages for these leading-edge applications.”
Elvino da Silveira, chief technical officer of the Lithography Systems Group, added, “As resolution, overlay and many other technical specifications become tighter and more sophisticated in advanced packaging processes, back-end manufacturers are choosing to move from aligners to steppers to meet these requirements. The JetStep System is a 2X reduction stepper with a large field of view (52mm x 66mm), and is unique in its ability to handle a wide spectrum of substrate sizes and warped wafers which may include glass interposers, panels of any shape and size, and standard and reconstituted wafers from 300mm to next-generation 450mm. An onboard, automated reticle library enhances throughput and ease-of-use. The JetStep stepper is part of a unique total lithography solution which integrates the stepper with Rudolph’s existing systems and software, including the NSX® Series inspection tool for CD and overlay measurements; ProcessWORKS® software for run-to-run, closed-loop process control; ARTIST® software for fault detection and classification; Discover® software for fabwide yield management; and the S3000S™ product family for resist thickness metrology.”
Paul F. McLaughlin, chairman and chief executive officer, noted, “Acceptance and the initial sale of the JetStep System is a milestone for Rudolph, validating the commercialization of our innovative 2X stepper total lithography solution which boasts industry leading cost-of-ownership benefits from a single supplier.
“Advanced packaging is in the early stages of dynamic growth and is a critical driver of mobile connectivity and, therefore, a critical driver for Rudolph. Consumer device demand is driving the need for new packaging technologies for 2.5D and 3D multi-die integration. These and other advanced wafer level packages now in development at leading IDMs, foundries and OSATs require a more sophisticated stepper lithography solution. The JetStep System’s flexible substrate handling and large field of view provide critical enablers for those processes.” Mr. McLaughlin concluded, “Semiconductor device manufacturers and OSAT providers need partners that deliver leading edge, back-end technology along with complete process solutions. Rudolph is a process control partner that can deliver improved production systems for advanced packaging applications and provide a flexible stepper capable of delivering unique solutions that meet their advanced requirements. The Rudolph JetStep 2X Solution is positioned not only for today’s leading edge packages, but also for future advanced packaging technology needs.”
For more information about Rudolph’s complete line of inspection, metrology and lithography systems for semiconductor manufacturing applications, please visit www.rudolphtech.com.
About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.
Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include Rudolph’s business momentum and future growth, the benefits to customers of Rudolph’s products, the market acceptance of Rudolph’s products and Rudolph’s ability to meet the expectations and needs of our customers as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, the challenges presented by the new product development and marketing, delays in shipping products for technical performance, component supply or other reasons, the company’s ability to leverage its resources to improve its positions in its core markets and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2012 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.e
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Steven R. Roth