Shrinking feature size, combined with increased I/O count, drive bumping processes toward tighter pitch and smaller sizes.
Bumping processes are trending toward smaller features to enable tighter integration and more functionality. The inspection and metrology required to ensure process control needs to have the resolution and accuracy to provide meaningful results that are well within the process tolerance window. Rudolph's 3D bump option can measure features down to 1um tall with diameters less than 10um. Balance accuracy and throughput for Cu pillar, microbumps and ball-drop bumps all on a single platform.
Accuracy of the measurement drives all results including die-based coplanarity, average bump heights, individual bump heights and all subsequent analysis. Rudolph's Truebump Technology leverages multiple technologies to help ensure that thin films present on the wafer do not falsely increase or decrease the resulting bump heights being reported.