The NSX family is the market leader for automated macro defect inspection for advanced packaging. Built on that success, the NSX 330 Series enables advanced packaging processes by directly improving the cost of ownership by enabling multiple applications in a single platform.
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
The NSX 330 System offers robust platform technology, including: high-acceleration staging, high-speed multi-processor computing and highly flexible software with an unprecedented level of usability. With over 1,000 NSX Systems installed worldwide, the NSX 330 System offers increased 2D inspection and metrology throughput and a broad portfolio of 3D sensors supporting critical advanced packaging applications.